Understanding IEC 60352-5:2020 PDF - The Standard for Solderless Press-in Connections
The upper limit of copper thickness in the plated‑through hole was modified to reflect actual market trends and manufacturing practices. Thick copper is rare in high‑volume production, and the standard no longer requires unrealistic extremes.
| Parameter | Requirement (Typical) | |-----------|----------------------| | Wire diameter | 0.1 mm to 1.0 mm (extensions for 1.5 mm by agreement) | | Terminal material | Cu-alloy, steel, or brass, typically tin or silver plated | | Number of turns | Minimum: 1.5 (starts: see standard fig.) | | Winding tension | Defined but depends on wire material and diameter | | Post condition | No burrs, correct hardness (typically HV 80–130) |